期刊
NANOTECHNOLOGY
卷 28, 期 20, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1088/1361-6528/aa6cda
关键词
printed electronics; bimodal Cu nanoparticles; flash light sintering; multi-pulse sintering; adhesion strength and resistivity
资金
- National Research Foundation of Korea (NRF) - Ministry of Education [2012R1A6A1029029]
- NRF - Ministry of Education [2015R1D1A1A09058418]
- NRF - Korean Government (MEST) [2013M2A2A9043280]
In this work, bimodal Cu nano-inks composed of two different sizes of Cu nanoparticles (NPs) (40 and 100 nm in diameter) were successfully sintered with a multi-pulse flashlight sintering technique. Bimodal Cu nano-inks were fabricated and printed with various mixing ratios and subsequently sintered by a flash light sintering method. The effects of the flashlight sintering conditions, including irradiation energy and pulse number, were investigated to optimize the sintering conditions. A detailed mechanism of the sintering of bimodal Cu nano-ink was also studied via real-time resistance measurement during the sintering process. The sintered Cu nano-ink films were characterized using x-ray photoelectron spectroscopy and scanning electron microscopy. From these results, it was found that the optimal ratio of 40-100 nm NPs was found to be 25:75 wt%, and the optimal multi-pulse flash light sintering condition (irradiation energy: 6 J cm(-2), and pulse duration: 1 ms, off-time: 4 ms, and pulse number: 5) was found. The optimally sintered Cu nano-ink film exhibited the lowest resistivity of 5.68 mu Omega cm and 5B adhesion level.
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