期刊
NANOTECHNOLOGY
卷 28, 期 37, 页码 -出版社
IOP PUBLISHING LTD
DOI: 10.1088/1361-6528/aa8196
关键词
liquid TEM cell; wafer bonding; parylene; thermal activation
资金
- Radiation Technology R&D program - National Research Foundation (MSIP, Korea) [NRF-2015M2A2A4A02044826]
- Technology Innovation Program - Ministry of Trade, Industry & Energy (MI, Korea) [10054488]
- 'R&D Center for reduction of Non-CO2 Greenhouse gases - Korea Ministry of Environment (MOE) as 'Global Top Environment RD Program [2015001690001]
- Korea Evaluation Institute of Industrial Technology (KEIT) [10054488] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- National Research Foundation of Korea [2015M2A2A4A02044826] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
Despite the importance of nanofluidic transmission electron microscope (TEM) chips, a simple fabrication method has yet to be developed due to the difficulty of wafer bonding techniques using a nanoscale thick bonding layer. We present a simple and robust wafer scale bonding technique using parylene as a bonding layer. A nanoscale thick parylene layer was deposited on a silicon nitride (SiN) wafer and patterned to construct nanofluidic channels. The patterned parylene layer was directly bonded to another SiN wafer by thermal surface activation and bonding, with a bonding strength of similar to 3 MPa. Fourier transform infrared spectroscopy showed that carbon- oxygen bonds were generated by thermal activation. We demonstrated TEM imaging of gold nanoparticles suspended in liquid using the fabricated nanofluidic chip.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据