4.6 Article

Nanofluidic chip for liquid TEM cell fabricated by parylene and silicon nitride direct bonding

期刊

NANOTECHNOLOGY
卷 28, 期 37, 页码 -

出版社

IOP PUBLISHING LTD
DOI: 10.1088/1361-6528/aa8196

关键词

liquid TEM cell; wafer bonding; parylene; thermal activation

资金

  1. Radiation Technology R&D program - National Research Foundation (MSIP, Korea) [NRF-2015M2A2A4A02044826]
  2. Technology Innovation Program - Ministry of Trade, Industry & Energy (MI, Korea) [10054488]
  3. 'R&D Center for reduction of Non-CO2 Greenhouse gases - Korea Ministry of Environment (MOE) as 'Global Top Environment RD Program [2015001690001]
  4. Korea Evaluation Institute of Industrial Technology (KEIT) [10054488] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
  5. National Research Foundation of Korea [2015M2A2A4A02044826] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

向作者/读者索取更多资源

Despite the importance of nanofluidic transmission electron microscope (TEM) chips, a simple fabrication method has yet to be developed due to the difficulty of wafer bonding techniques using a nanoscale thick bonding layer. We present a simple and robust wafer scale bonding technique using parylene as a bonding layer. A nanoscale thick parylene layer was deposited on a silicon nitride (SiN) wafer and patterned to construct nanofluidic channels. The patterned parylene layer was directly bonded to another SiN wafer by thermal surface activation and bonding, with a bonding strength of similar to 3 MPa. Fourier transform infrared spectroscopy showed that carbon- oxygen bonds were generated by thermal activation. We demonstrated TEM imaging of gold nanoparticles suspended in liquid using the fabricated nanofluidic chip.

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