Using Methods of Thermal, Electric, Adapter and Probe Control to Analyze Work of Integral Chips

Presented description and characteristics of methods thermal, electrical, adapter and probe control, used for analysis of functioning integral chip. The relevance of using adapter and probe control consists in the possibility of investigation of the integrity of chip on macroscopic scale with measurement macroscopic current and voltage values on different parts of circuit and detecting. Third-party inclusions or integrity violation, required for providing hardware protection of calculating machine. To monitor the electrical characteristics of structures and the quality of technological operations, structures specially designed or placed on a working substrate, called test chips, are used. The main principle of their construction is that the test chip in relation to the real one should be made along the same technological route, contain all the structural elements in various combinations and ensure the convenience of their control during the tests and the evaluation of the quality of the technological process. Control convenience is achieved either by sequential or parallel inclusion of the chip elements in the electrical circuit. The test resistor circuit may be a sequential circuit containing a group of elements between which there are contact pads. If in a real IC there are high-resistance and low-resistance resistors, then make two different test chips that reflect the specificity of each type of resistors. A similar approach is used for test circuits of transistors and diodes.