期刊
MATERIALS CHEMISTRY AND PHYSICS
卷 199, 期 -, 页码 1-6出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.matchemphys.2017.06.036
关键词
High-entropy alloy; Wettability; Cu content; Interface; Diffusion
资金
- China Postdoctoral Science Foundation [2016M601333]
- Liaoning Provincial Natural Science Foundation of China [201602518]
- Liaoning province department of education fund [LJQ2014134]
Wettability between the molten Sn and AlCoCrCuxFeNi (x = 0, 0.5, 1, 1.5) high-entropy alloy (HEA) substrates was studied by sessile drop technique at 823 K. The final contact angle decreased with the increase of Cu content in the AlCoCrFeNi HEA. Additional Cu could not only change surface structure of AlCoCrFeNi HEA but also effect on the interfacial reaction between the molten Sn and AlCoCrCuxFeNi HEA. Moreover, with the increasing concentration of Cu, the diffusion of Sn atom along the Cu-rich solid solution phase in AlCoCrCuxFeNi HEA was much more intense. Accordingly, the enhancement of wetting may be attributed to change of the primary interface reaction product and diffusion of Sn atom along the Cu-rich solid-solution phase. (C) 2017 Elsevier B.V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据