期刊
2019 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC)
卷 62, 期 -, 页码 136-+出版社
IEEE
DOI: 10.1109/isscc.2019.8662447
关键词
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资金
- Samsung Research Funding & Incubation Center for Future Technology [SRFC-TB1703-09]