期刊
JOURNAL OF INFORMATION DISPLAY
卷 20, 期 2, 页码 73-80出版社
TAYLOR & FRANCIS LTD
DOI: 10.1080/15980316.2018.1540365
关键词
Atomic layer deposition; indium gallium zinc oxide; thin-film transistor; high mobility; density of state
资金
- LG Display Company
This paper reports the effect of the cation composition on the electrical properties of amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs) where atomic layer deposition (ALD) was used to deposit an a-IGZO channel layer. The In0.38Ga0.18Zn0.44O transistors at a 200 degrees C annealing temperature exhibited 39.4cm(2)/V.s field effect mobility (mu(FE)), -0.12V threshold voltage (V-TH), 0.40 V/decade subthreshold gate swing (SS), and >10(7) I-ON/OFF ratio, corresponding to the state-of-the-art characteristics of transistors with a sputtered IGZO channel. Further enhancement of the mu(FE) value was observed for the devices with a higher In fraction: the In0.45Ga0.15Zn0.40O transistor had a higher mu(FE) value of 48.3 cm(2)/V.s, -4.06 V V-TH, 0.45 V/decade SS, and >10(7) I-ON/OFF ratio. The cation composition dependence on the performance of the a-IGZO TFTs was explained by analysing the density-of-state (DOS) distribution for the corresponding devices using the experimental independent variable (IV) and theoretical Technology Computer-aided Design (TCAD) simulation.
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