A dismantlable photoadhesion system fabricated by an anionic UV curing of epoxy resins with a base amplifier having a disulfide bond

A base amplifier (BA) that autocatalytically generates a diamine having a disulfide bond has been developed. Diamines generated from this BA are integrated into cross-linked networks of epoxy resins that also have disulfide bonds. Anionic UV curing is performed using a photobase generator, the BA and the epoxy resins, and cured films are obtained after UV irradiation and subsequent heating at 160 degrees C. Furthermore, this curing system is applied successfully to adhesion of two stainless substrates, which is cancelled with gentle heating and a shear force. (c) 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2018, 56, 237-241