3.8 Proceedings Paper

Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application

出版社

IEEE
DOI: 10.23919/icep.2019.8733416

关键词

FHE; FOWLP; and Stress Buffer Layer

资金

  1. JSPS KAKENHI [18K18841]
  2. Grants-in-Aid for Scientific Research [18K18841] Funding Source: KAKEN

向作者/读者索取更多资源

A new flexible hybrid electronics (FHE) approach is studied for integrating high-performance and scalable flexible systems at the wafer level. The unique structure is consisting of monocrystalline semiconductor dielets embedded in flexible substrates such as elastomers. Stress buffer layers (SBL) as a key material are inserted between inter-dielet wirings and the substrates to enhance wire reliability. The impact of the SBL properties on the bendability of the FHE systems is described in this work.

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