期刊
2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)
卷 -, 期 -, 页码 265-267出版社
IEEE
DOI: 10.23919/icep.2019.8733416
关键词
FHE; FOWLP; and Stress Buffer Layer
资金
- JSPS KAKENHI [18K18841]
- Grants-in-Aid for Scientific Research [18K18841] Funding Source: KAKEN
A new flexible hybrid electronics (FHE) approach is studied for integrating high-performance and scalable flexible systems at the wafer level. The unique structure is consisting of monocrystalline semiconductor dielets embedded in flexible substrates such as elastomers. Stress buffer layers (SBL) as a key material are inserted between inter-dielet wirings and the substrates to enhance wire reliability. The impact of the SBL properties on the bendability of the FHE systems is described in this work.
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