Effects of nanoparticles on the thermal, microstructural and mechanical properties of novel Sn3.5Ag0.5Zn composite solders

The effects of added nanoparticles (i.e., Al2O3 and TiO2) on the thermal, microstructural and mechanical properties of Sn3.5Ag0.5Zn nanocomposite solders have been investigated. Adding nanoparticles to the Sn3.5Ag0.5Zn solder increases the melting temperature by only 2.1-4.6 A degrees C. It was also confirmed that the nanoparticles affect the microstructural and mechanical properties. The UTS, 0.2 YS, and microhardness of the Sn3.5Ag0.5Zn nanocomposite solder improved, which could be attributed to the refinement of the beta-Sn grain size, the precipitation of Ag-3(Sn, Zn) grains, and the second phase dispersion strengthening mechanism. The fracture mechanism of Sn3.5Ag0.5Zn nanocomposite solders was confirmed to be the ductile fracture mode. The cracks were initiated at the interfaces between beta-Sn(Zn) grains and Ag(Zn, Sn) phases.