期刊
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
卷 242, 期 -, 页码 235-245出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2016.11.031
关键词
Lead-free solder; Reflow soldering; Microstructure; Intermetallic; Interfacial reaction; Shear strength
资金
- University of Queensland (UQ)-Nihon Superior (NS) collaboration research project
- ARC Linkage project [LP140100485]
- Australian Research Council [LP140100485] Funding Source: Australian Research Council
The growth of Cu6Sn5 and Cu3Sn5 interfacial layers after isothermal annealing and the resultant effect on the solder joint strength are studied in TiO2 and Ni containing Sn0.7Cu solders. These composite solders were fabricated using a powder metallurgy method and reflow soldered on a Cu substrate printed circuit board (PCB) with an organic soldering preservative (OSP) surface finish. With TiO2 additions, a more planar scalloped Cu6Sn5 morphology was observed with reduced interfacial boundary grooves while a fine scallop-shaped interfacial (Cu,Ni)(6)Sn-5 layer was observed in Ni containing solder joints. The interfacial layer was further suppressed with a combination of Ni and TiO2 even after annealing which resulted in superior shear strength and fracture energy. (C) 2016 Elsevier B.V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据