Epoxy/triazine copolymer resin system for high temperature encapsulant applications

The seeking of high temperature stable packaging materials was driven by the progress seen in wide band gap (WBG) semiconductor-based power electronic devices. Epoxy molding compounds (EMCs) are widely used in the packaging industry as the utmost protection of packages. However current EMC chemistry cannot support the high operating temperature in WBG devices. The rigid triazine structure can provide enhanced high temperature performance in epoxy molding compound. In this report, the effect of adding a triazine based epoxy, triglycidyl isocyanurate (TGIC) in cyanate ester/epoxy copolymer was presented. The curing chemistry, thermo-mechanical properties and high temperature aging performance were evaluated.