Heterogeneous Integration Using Omni-Directional Interconnect Packaging

We present a new packaging building block for 3D integrated circuits: Omni Directional Interconnect (ODI). It adds a new degree of freedom in packaging that enables combining the high bandwidth benefit of standard 3D stacking with the minimal die area, thermal performance and direct power delivery of 2D packaging. ODI performance and cost benefits in high-performance computing are summarized. It is shown that by using careful assembly strategy, the required tolerances can be made the same as other 2.5/3D technologies. The fabrication results for two of the architectures are included and show good repeatability and robust assembly.