期刊
2019 SYMPOSIUM ON VLSI TECHNOLOGY
卷 -, 期 -, 页码 T230-T231出版社
IEEE
DOI: 10.23919/vlsit.2019.8776570
关键词
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This paper presents key specifications of RRAM-based nonvolatile memory embedded into Intel 22FFL FinFET Technology. 22FFL is a high performance, ultra low power technology developed for mobile and RF applications providing extensive high voltage and analog support and high design flexibility combined with low manufacturing costs [1]. Embedded RRAM technology presented in this paper achieves 10(4) cycle endurance combined with 85 degrees C 10-year retention and high die yield. Technology data retention, endurance and yield are demonstrated on 7.2Mbit arrays. We describe device characteristics, bit cell integration into the logic flow, as well as key considerations for achieving high endurance and retention properties.
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