相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Effect of alumina nanoparticles on the microstructure and mechanical durability of meltspun lead-free solders based on tin alloys
K. Mehrabi et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets
Guang Chen et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Microstructure, mechanical and electrical performances of zirconia nanoparticles-doped tin-silver-copper solder alloys
Asit Kumar Gain et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2016)
Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement
Yi Li et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)
Effects of Fe2NiO4 nanoparticles addition into lead free Sn-3.0Ag-0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
Srivalli Chellvarajoo et al.
MATERIALS & DESIGN (2015)
Effects of diamond nanoparticles reinforcement into lead-free Sn-3.0Ag-0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
Srivalli Chellvarajoo et al.
MATERIALS & DESIGN (2015)
In-situ alloying of Sn-3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers
A. S. M. A. Haseeb et al.
INTERMETALLICS (2014)
Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate
G. K. Sujan et al.
MATERIALS CHARACTERIZATION (2014)
Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging
JianXin Wang et al.
MICROELECTRONICS RELIABILITY (2014)
Dependence of the viscosity of nanofluids on nanoparticle size and material
V. Ya. Rudyak et al.
PHYSICS LETTERS A (2014)
Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate
S. L. Tay et al.
INTERMETALLICS (2013)
Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process
Y. Tang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2013)
Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate
Y. H. Chan et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2013)
Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder
Wei Zhang et al.
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY (2012)
Effects of addition of copper particles of different size to Sn-3.5Ag solder
Aemi Nadia et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2012)
Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds
A. S. M. A. Haseeb et al.
MATERIALS CHARACTERIZATION (2012)
Shear viscosity enhancement in water-nanoparticle suspensions
Ganesh Balasubramanian et al.
PHYSICS LETTERS A (2012)
Effects of Co nanoparticle addition to Sn-3.8Ag-0.7Cu solder on interfacial structure after reflow and ageing
A. S. M. A. Haseeb et al.
INTERMETALLICS (2011)
Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates
Asit Kumar Gain et al.
MICROELECTRONICS RELIABILITY (2011)
Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu in the presence of Mo nanoparticles
M. M. Arafat et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2011)
Understanding the effects of addition of copper nanoparticles to Sn-3.5 Ag solder
Aemi Nadia et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2011)
Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing
S. L. Tay et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2011)
Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
Kazuhiro Nogita
INTERMETALLICS (2010)
Additive Occupancy in the Cu6Sn5-Based Intermetallic Compound Between Sn-3.5Ag Solder and Cu Studied Using a First-Principles Approach
Feng Gao et al.
JOURNAL OF ELECTRONIC MATERIALS (2010)
Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures
Moon Gi Cho et al.
APPLIED PHYSICS LETTERS (2009)
Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth
Y. W. Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Wettability and interfacial reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu solder joints
Jeong-Won Yoon et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu
Y. W. Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Effect of nanoparticle size on the onset temperature of surface melting
A. P. Chernyshev
MATERIALS LETTERS (2009)
Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads
S. K. Das et al.
MICROELECTRONIC ENGINEERING (2009)
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers
T. Laurila et al.
MICROELECTRONICS RELIABILITY (2009)
Dissolution of Cu nanoparticles and antibacterial behaviors of TaN-Cu nanocomposite thin films
P. C. Liu et al.
THIN SOLID FILMS (2009)
Melting entropy and enthalpy of metallic nanoparticles
M. Attarian Shandiz et al.
MATERIALS LETTERS (2008)
A study of nanoparticles in Sn-Ag based lead free solders
Masazumi Amagai
MICROELECTRONICS RELIABILITY (2008)
Creep properties of composite solders reinforced with nano- and microsized particles
Yaowu Shi et al.
JOURNAL OF ELECTRONIC MATERIALS (2008)
Investigation of dissolution behavior of metallic substrates and intermetallic compound in molten lead-free solders
Yee-Wen Yen et al.
JOURNAL OF ELECTRONIC MATERIALS (2008)
First-principles investigation of the structural and electronic properties of Cu6-xNixSn5 (x=0, 1, 2) intermetallic compounds
Chun Yu et al.
INTERMETALLICS (2007)
Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives
Feng Gao et al.
JOURNAL OF ELECTRONIC MATERIALS (2006)
Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder
J. Shen et al.
JOURNAL OF ELECTRONIC MATERIALS (2006)
Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites
SML Nai et al.
THIN SOLID FILMS (2006)
Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing
F Gao et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2006)
Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
SK Kang et al.
JOURNAL OF ELECTRONIC MATERIALS (2006)
Metallurgy and kinetics of liquid-solid interfacial reaction during lead-free soldering
J Liang et al.
MATERIALS TRANSACTIONS (2006)
Size effect on melting temperature of nanosolids
WH Qi
PHYSICA B-CONDENSED MATTER (2005)
Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition
FJ Wang et al.
SCRIPTA MATERIALIA (2005)
Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin-lead solder
DC Lin et al.
MATERIALS LETTERS (2003)
A study on the reaction between cu and Sn3.5Ag solder doped with small amounts of Ni
JY Tsai et al.
JOURNAL OF ELECTRONIC MATERIALS (2003)
The influence of copper nanopowders on microstructure and hardness of lead-tin solder
D Lin et al.
MATERIALS LETTERS (2002)
Size-dependent melting point depression of nanostructures: Nanocalorimetric measurements
M Zhang et al.
PHYSICAL REVIEW B (2000)
Experimental study of particle incorporation during dendritic solidification
G Wilde et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2000)