期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 46, 期 7, 页码 4076-4084出版社
SPRINGER
DOI: 10.1007/s11664-016-5181-2
关键词
Lead-free solder; solderability; melting; wetting balance; contact angle; fluidity; wave soldering
资金
- Mitacs
In this study, the effects of Ag, Ni and Bi additions on the melting, solidification, fluidity and wetting behavior of Sn-0.7Cu base solder alloy are studied. The addition of a small amount of Ni reduces the undercooling and improves the feeding distance (fluidity length); however, Ni does not improve the wetting and the spreading performance. The effect of Ni on the fluidity length of Ag-containing Sn-0.7Cu (SAC alloy) is marginal. Bi and Ag both improve wetting performance and also lower the melting temperature; however, they do not improve the fluidity; instead, they reduce the maximum length of fluidity.
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