相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。A superior interfacial reliability of Fe-Ni UBM during high temperature storage
Li-Yin Gao et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2017)
Solid-state interfacial reactions of Sn and Sn-Ag-Cu solders with an electroless Co(P) layer deposited on a Cu substrate
Chao-hong Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling
Quan Zhou et al.
JOURNAL OF ELECTRONIC MATERIALS (2016)
The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling
Ying Zhong et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)
Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages
Bite Zhou et al.
JOURNAL OF ELECTRONIC MATERIALS (2015)
Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects
Tae-Kyu Lee et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
Reinforced solder joint performance by incorporation of ZrO2 nanoparticles in electroless Ni-P composite layer
Xiao Hu et al.
JOURNAL OF MATERIALS RESEARCH (2014)
Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures
Nianduan Lu et al.
ACTA MATERIALIA (2013)
Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD
Bite Zhou et al.
JOURNAL OF ELECTRONIC MATERIALS (2013)
Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters
Jussi Hokka et al.
JOURNAL OF ELECTRONIC MATERIALS (2013)
Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections-Part 2: Failure Mechanisms
Jussi Hokka et al.
JOURNAL OF ELECTRONIC MATERIALS (2013)
Electroless Deposition of Highly Solderable Fe-Ni Films
Haifei Zhou et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2013)
Comparison of spreading behaviour and interfacial microstructure in Sn-0.7Cu, Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu lead free solder alloys on Fe-42Ni substrate
S. Narayan et al.
MATERIALS SCIENCE AND TECHNOLOGY (2013)
Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing
J. H. Ke et al.
ACTA MATERIALIA (2012)
WAFER LEVEL ELECTRODEPOSION OF Fe-Ni NOVEL UBM FILMS
Zhang Hao et al.
ACTA METALLURGICA SINICA (2012)
Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress
Hongtao Chen et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2012)
The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints
Thomas R. Bieler et al.
JOURNAL OF ELECTRONIC MATERIALS (2012)
Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue
Liang Yin et al.
JOURNAL OF ELECTRONIC MATERIALS (2012)
3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy
LayWai Kong et al.
MICROELECTRONIC ENGINEERING (2012)
Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints
Xiaoyan Li et al.
JOURNAL OF ELECTRONIC MATERIALS (2011)
Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5
Dekui Mu et al.
JOURNAL OF MATERIALS RESEARCH (2011)
Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling
Hongtao Chen et al.
JOURNAL OF MATERIALS RESEARCH (2011)
The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading
Toni Tuomas Mattila et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2010)
Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging
Chi-Yang Yu et al.
JOURNAL OF ELECTRONIC MATERIALS (2010)
Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization
X. F. Zhang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Reliability of CSP interconnections under mechanical shock loading conditions
Toni T. Mattila et al.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (2006)
Strain-based approach to crack growth and thermal fatigue life of hot work tool steels
A Persson
SCANDINAVIAN JOURNAL OF METALLURGY (2004)
Physics and materials challenges for lead-free solders
KN Tu et al.
JOURNAL OF APPLIED PHYSICS (2003)
Kinetic theory of flux-driven ripening
AM Gusak et al.
PHYSICAL REVIEW B (2002)
Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
HLJ Pang et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2001)
分享论文
