4.4 Article

High-Frequency Characteristics of InGaP/GaAs Double Heterojunction Bipolar Transistor Epitaxially Grown on 200 mm Ge/Si Wafers

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出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JEDS.2020.2967406

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III-V/Si integration; bipolar transistors; semiconductor growth

资金

  1. National Research Foundation Singapore through the Singapore MIT Alliance for Research and Technology's Low Energy Electronic Systems [IRG]

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N-p-n InGaP/GaAs double heterojunction bipolar transistor has been successfully grown on a 200 mm Ge/Si wafer using metalorganic chemical vapor deposition with low defect density of 10(7) cm (-2). Non-gold metals of Ni/Ge/Al and Ti/Al are used to form the ohmic contact for small pieces device fabrication. Both direct-current (dc) and high-frequency characteristics of the device were measured. The device with emitter area of 6 x 8 mu m(2) shows a dc gain of 55 at a collector current of I-c = 4 mA, with high collector-emitter breakdown voltage of similar to 17 V. The high-frequency response with cutoff frequency (f(T)) of 23 GHz and maximum available frequency (f(max)) of 10 GHz can be achieved. These results demonstrate that InGaP/GaAs double heterojunction bipolar transistor grown on low defect density Ge/Si wafer has the potential for realizing III-V CMOS integrated platform for high-frequency applications.

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