Fabrication of Optimally Micro-Textured Copper Substrates by Plasma Printing for Plastic Mold Packaging

Micro-embossing using plasma printed micro-punch was proposed to form micro-groove textures into the copper substrate for plastic packaging of hollowed GaN HEMT-chips. In particular, the micro-groove network on the copper substrate was optimized to attain uniform stress distribution with maximum stress level being as low as possible. Three-dimensional finite element analysis was employed to investigate the optimum micro-grooving texture-topology and to attain the uniform stress distribution on the joined interface between the plastic mold and the textured copper substrate. Thereafter, plasma printing was utilized to fabricate the micro-punch for micro-embossing of the micro-grooving network into the copper substrate as a designed optimum micro-texture. This plasma printing mainly consisted of three steps. Two-dimensional micro-pattern was screen-printed onto the AISI316 die surface as a negative pattern of the optimum CAD data. The screen-printed die was plasma nitrided at 673K for 14.4 ks at 70 Pa under the hydrogen-nitrogen mixture for selective nitrogen supersaturation onto the unprinted die surfaces. A micro-punch was developed by mechanically removing the printed parts of die material. Then, fine computer numerical control (CNC) stamping was used to yield the micro-embossed copper substrate specimens. Twelve micro-textured substrates were molded into packaged specimens by plastic molding. Finally, gross leak testing was employed to evaluate the integrity of the joined interface. The takt time required to yield the micro-grooved copper substrate by the present method was compared to the picosecond laser micro-grooving; the former showed high productivity based on this parameter.