期刊
INTERNATIONAL JOURNAL OF LEAN SIX SIGMA
卷 11, 期 6, 页码 1141-1173出版社
EMERALD GROUP PUBLISHING LTD
DOI: 10.1108/IJLSS-09-2018-0100
关键词
Structural model; Lean manufacturing; MICMAC analysis; Total interpretive structural modeling; Electrical and electronics component manufacturing; Leanness; Barriers; Interpretation statements
Purpose The purpose of this paper is to present the analysis of barriers affecting the adoption of lean concepts to electrical and electronics component manufacturing. Design/methodology/approach Lean concepts are being increasingly applied by electrical and electronics component manufacturers to enhance product value through streamlined process. To facilitate smooth adoption of lean concepts, barriers need to be analyzed and prioritized. In this context, a structural model of 24 barriers is developed through total interpretive structural modeling (TISM) approach. Findings 'Changing governmental policies,' 'poor selection of change agents and improvement teams,' 'lack of top management commitment understanding and support of the system,' 'lack of team autonomy,' 'lack of flexibility and versatility' and 'lack of customer focus/involvement' are found to be the dominant barriers based on TISM study. Interpretation statements are being derived from TISM model. Cross-impact matrix multiplication applied to classification analysis is conducted. Originality/value The development of structural model for the analysis of barriers to lean implementation in electronics component manufacturing small- and medium-sized enterprises is the original contribution of the authors.
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