4.7 Article

Grain size stabilization and strengthening of cryomilled nanostructured Cu 12 at% Al alloy

期刊

JOURNAL OF ALLOYS AND COMPOUNDS
卷 716, 期 -, 页码 197-203

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ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2017.05.093

关键词

Cryomilling; Nanocrystalline; Thermal stabilization; Cu-Al alloys; Intermetallics

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Nanocrystalline Cu12 at% Al alloy was synthesized by high energy ball milling under cryogenic condition. The alloy was then annealed up to 900 degrees C (or 0.87 T-m). Phase and microstructural evaluation were carried out by X-ray diffraction (XRD), transmission electron microscopy (TEM) and the mechanical property was investigated by microhardness testing. Results show that at elevated temperatures grain growth of Cu 12 at% Al alloy is much less than pure Cu prepared under same condition. The microhardness of the alloy decreases from 2.91 GPa to 2.73 GPa (similar to 6% decrease) after annealing at 900 degrees C. Superior thermal stability at high temperature was ascribed to the grain boundary pinning by nano-scale intermetallic particles. Kinetically stabilized grain size and hardness show good agreement with theoretical predictions. (C) 2017 Elsevier B.V. All rights reserved.

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