3.8 Proceedings Paper

Microstructure and surface profiling study on the influence of substrate type on sputtered aluminum thin films

期刊

MATERIALS TODAY-PROCEEDINGS
卷 26, 期 -, 页码 1496-1499

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ELSEVIER
DOI: 10.1016/j.matpr.2020.02.309

关键词

Aluminum thin films; Microstructure; Sputtering; Substrate; Surface roughness

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  1. University Research Committee (URC)

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In this article, the influence of the type of substrates on properties of aluminum thin films prepared through sputtering technology is presented. The deposition was undertaken at constant substrate temperature of 90 degrees C and RF power of 350W for 2 h on glass and steel substrates. Microstructural properties were analyzed using field emission scanning electron microscopy (FESEM). The optical non-contact surface profiler (OSP) was used to study the topology and roughness characteristics of the films on different substrates. The results show that films grown on mild and stainless-steel substrates exhibited different morphologies and surface topology from those grown on glass substrates, indicating the influence of the substrate type on the deposition, nucleation, growth and film formation of Al thin films. (C) 2019 Elsevier Ltd. All rights reserved. Selection and peer-review under responsibility of the scientific committee of the 10th International Conference of Materials Processing and Characterization.

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