期刊
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
卷 110, 期 -, 页码 827-844出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijheatmasstransfer.2017.03.082
关键词
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资金
- National Natural Science Foundation of China [51428603, 51576145]
- National Science Foundation [CBET1235852, CMMI1264399]
- Department of Energy [DENE0000671, DE-EE0007686]
- Iowa Energy Center [MG-16-025, OG-17-005]
- Div Of Chem, Bioeng, Env, & Transp Sys
- Directorate For Engineering [1235852] Funding Source: National Science Foundation
- Div Of Civil, Mechanical, & Manufact Inn
- Directorate For Engineering [1264399] Funding Source: National Science Foundation
The miniaturization in energy devices and their critical needs for heat dissipation have facilitated research on exceptional thermal properties of novel low-dimensional materials. Current studies demonstrated the main challenge for solving thermal transport issues is the large thermal contact resistance across these low-dimensional material interfaces when they are either bundled together or supported by a substrate. A clear understanding of thermal transport across these atomic interfaces through experimental characterization or numerical simulation is important, but nontrivial. Due to instrumentation limit, only a few thermal characterization methods are applicable. Accordingly, many studies have been conducted by theoretical analysis and molecular dynamics to understand the physical process during this ultra-fast and ultra-small thermal transport. In this review, both experimental work and molecular dynamics studies on atomic-scale thermal contact resistance of low-dimensional materials (from zero to two-dimensional) are reviewed. Challenges as well as opportunities in the study of thermal transport in atomic-layer structures are outlined. Considering the remarkable complexity of physical/chemical conditions, there is still a large room in understanding fundamentals of energy coupling across these atomic layer interfaces. (C) 2017 Elsevier Ltd. All rights reserved.
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