期刊
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
卷 115, 期 -, 页码 77-85出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijheatmasstransfer.2017.08.001
关键词
Nanofluid; Energy; Mini-channel; Water block; Friction factor; Electronics cooling
资金
- High Impact Research MoE Grant from the Ministry of Education Malaysia [UM.C/625/1/HIR/MoE/ENG/40]
Heat dissipation is a critical issue in modern electronic components, due to the technological advances that have reduced their size and caused their heat flux to rise. Different types of heat sinks are promising for cooling of such electronics and nanofluid can enhance the cooling performances. In this present work, a titanium dioxide (TiO2/water) nanofluid (with a volume fraction of 0.1%) is prepared by dispersing nanoparticles in distilled water. The nanofluid is then passed through the heat sink at various flow rates (1.00, 1.25, and 1.50 L/min). The interface temperature of the water block was reduced up to 6.40 degrees C by using the nanofluid, as compared to water. Due to the decline of interface temperature the heat transfer coefficient was improved by 20.82% compared to water. The maximum energy efficiency found 77.56% for nanofluid. Therefore, the titanium dioxide nanofluid is a superior coolant than pure water. Moreover, the heat transfer effectiveness and energy effectiveness were found highest at the minimum flow rate of 1.00 L/min. (C) 2017 Elsevier Ltd. All rights reserved.
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