Formation mechanism of wire bow and its influence on diamond wire saw process and wire cutting capability

Wire bow is the most important factor affecting wire sawing capability of silicon ingots. In this paper, the wire bow, contact length in cutting zone which reflects the DWS process are emphasized. The real-time signals of wire bow are analyzed after a series of cutting tests. The relationship between cutting power and MRR was built for identifying the cutting condition of diamond wire. And it was found the cutting capability of diamond wire was losing with the wire feed into the ingots which is accompanied by the increase of wire bow. The silicon wafer surface was observed by SEM and 3D profiler to analyze the geometric characteristics of wire bow, wire mark morphology and surface topography. This research is used to master the formation mechanism of wire bow and its influencing factors in order to control the loss of wire cutting capability.