期刊
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
卷 21, 期 1, 页码 689-711出版社
TAYLOR & FRANCIS LTD
DOI: 10.1080/14686996.2020.1824255
关键词
Low temperature solder; wettability; microstructure; mechanical properties; oxidation resistance
资金
- Key project of State Key Laboratory of Advanced Welding and Joining [AWJ-19Z04]
- Central Plains science and technology innovation talent plan [ZYQR20180030]
- National Key Research and Development Project [2019YFF0217400]
Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders.
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