4.7 Article

Ultra-sensitive and durable strain sensor with sandwich structure and excellent anti-interference ability for wearable electronic skins

期刊

COMPOSITES SCIENCE AND TECHNOLOGY
卷 200, 期 -, 页码 -

出版社

ELSEVIER SCI LTD
DOI: 10.1016/j.compscitech.2020.108448

关键词

Flexible composites; Polymer-matrix composites (PMCs); Electrical properties

资金

  1. National Natural Science Foundation of China [51773183, U1804133]
  2. National Natural Science Foundation of China-Henan Province Joint Funds [U1604253]
  3. Henan Province University Innovation Talents Support Program [20HASTIT001]
  4. Innovation Team of Colleges and Universities in Henan Province [20IRTSTHN002]

向作者/读者索取更多资源

Smart and wearable strain sensors have sparked enormous research interests in various applications of flexible electronic devices. For this topic, it remains a huge challenge to acquire wide sensing range, high sensitivity, superior durability and fast response synergistically. Herein, we present an ultra-sensitive and durable strain sensor with sandwich structure to address the issues, which is mainly composed of the composite of carbon black (CB)/aligned thermoplastic polyurethane (TPU) fibrous mat and the Ecoflex. The CB/TPU/Ecoflex strain sensor (CTESS) is prepared via decorating CB nanoparticles onto the aligned electrospun TPU fibrous mats by ultra-sonication, then encapsulated with Ecoflex to develop a sandwich structure. This structure provides effective protection for the conductive CB/TPU fibrous network, endowing the strain sensor with excellent sensing performances, including low detection limit (0.5% strain), wide response range (up to 225% strain), ultrahigh sensitivity (maximum gauge factor of 3186.4 at strain of 225%), fast response time (70 ms) and favorable repeatability even after 5000 stretching/releasing cycles. CTESS also shows an excellent anti-interference capability to external humidity and temperature. The CTESS is then assembled as artificial electronic skins to monitor various human motions, exhibiting great application prospects in next-generation wearable electronics.

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