期刊
IEEE TRANSACTIONS ON POWER ELECTRONICS
卷 32, 期 2, 页码 1431-1441出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TPEL.2016.2546944
关键词
Narrow junction temperature cycles; power cycling test; reliability; stress concentration; solder failure
资金
- National Natural Science Foundation of China [51477019, 51137006, 51577074]
- U.K. EPSRC [EP/L007010/1, EP/K034804/1]
- Fundamental Research Funds for the Central Universities [106112015CDJXY150004]
- EPSRC [EP/F061811/1, EP/L021579/1, EP/L007010/1, EP/K034804/1] Funding Source: UKRI
- Engineering and Physical Sciences Research Council [EP/L007010/1, EP/K034804/1, EP/F061811/1, EP/L021579/1] Funding Source: researchfish
This paper presents a series of experiment results on the ageing effects of cyclic junction temperature variations (Delta T-j) of low amplitudes in power modules, to help the capturing of module reliability characteristics and the derivation of lifetime models in the future. Power cycling tests, for nonaged and aged modules, are designed to illustrate the failure mechanisms. Insulated gate bipolar transistor (IGBT) modules in actual converters are usually operated in a Delta T-j range up to 40 degrees C; therefore, tests are carried out to observe the effects of such narrow Delta T-j stress cycles on the module lifetime. It is found that the relatively minor stress cycles may not be able to directly initiate a crack but can contribute to the development of damage in the die attach solder layer due to stress concentration. Finite element analysismodeling is utilized to verify the stress concentration effect. The experiment results show that the effects of the narrow Delta T-j stress cycles are affected by the ageing status of the module and the stress level itself.
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