4.6 Article Proceedings Paper

Control of Junction Temperature and Its Rate of Change at Thermal Boundaries via Precise Loss Manipulation

期刊

IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
卷 53, 期 5, 页码 4796-4806

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TIA.2017.2710038

关键词

Control systems; fatigue; finite-state machines; power conversion; power semiconductor devices; reliability management; temperature control; temperature measurement; thermal factors

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To optimize the lifetime of switching power semiconductors, this paper presents a methodology to control power device junction temperature T-j and its change during power cycles Delta T-j at thermal boundaries. This paper proposes a supervisory state machine to interrupt nominal system-level control only when temperature bounds are exceeded, and coordinates smooth transitions as T-j (k) and Delta T-j (k) approach their respective boundaries. To ensure that thermal states are regulated via precise and independent modulation of conduction and switching loss elements, decoupling methods are proposed. Also proposed is a Delta T-j control law that closes a control loop on the rate of change state T-j, and introduces active thermal capacitance and conductance into the closed-loop thermal system dynamics. Experimental evaluation of the proposed system illustrates well damped T-j (k) and Delta Tj (k) responses, and gradual adjustment of the manipulated inputs switching frequency and duty ratio. Finally, comparison with a current limit-based T-j regulation method illustrates how the proposed system allows power converters to push harder against their thermal limits.

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