4.8 Article

Polyaramid-Based Flexible Antibacterial Coatings Fabricated Using Laser-Induced Carbonization and Copper Electroplating

期刊

ACS APPLIED MATERIALS & INTERFACES
卷 12, 期 47, 页码 53193-53205

出版社

AMER CHEMICAL SOC
DOI: 10.1021/acsami.0c13058

关键词

Polyaramid; laser-induced carbonization; copper electroplating; flexible circuits; antibacterial coating

资金

  1. Deutsche Forschungsgemeinschaft (DFG,German Research Foundation) under Germany's Excellence Strategy via the Excellence Cluster 3D Matter Made to Order [EXC-2082/1-390761711]
  2. European Union's Future and Emerging Technologies Framework [H2020-FETOPEN-1-2016-2017-737043-TISuMR]
  3. BMBF grant ANTIBIOTIKA [03VP02840]
  4. German Academic Exchange Service (DAAD) under the German Egyptian Research LongTerm Scholarship Program (GERLS)
  5. Virtual Materials Design (VIRTMAT) initiative at KIT
  6. Karlsruhe Institute of Technology

向作者/读者索取更多资源

A method for the fabrication of flexible electrical circuits on polyaramid substrates is presented based on laser-induced carbonization followed by copper electroplating. Locally carbonized flexible sheets of polyaramid (Nomex), by laser radiation, create rough and highly porous microstructures that show a higher degree of graphitization than thermally carbonized Nomex sheets. The found recipe for laser-induced carbonization creates conductivities of up to similar to 45 S cm(-1), thereby exceeding that observed for thermally pyrolyzed materials (similar to 38 S cm(-1)) and laser carbon derived from Kapton using the same laser wavelength (similar to 35 S cm(-1)). The electrical conductivity of the carbonized tracks was further improved by electroplating with copper. To demonstrate the electrical performance, fabricated circuits were tested and improvement of the sheet resistance was determined. Copper films exhibit antimicrobial activity and were used to fabricate customized flexible antibacterial coatings. The integration of laser carbonization and electroplating technologies in a polyaramid substrate points to the development of customized circuit designs for smart textiles operating in high-temperature environments.

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