Using Methods of Reconstruction of Pins, Magnetic Resonance Imaging and Computer Tomography to Analyze Integrated Circuits in Microprocessor Systems

One of the features of electronic items production is that a batch of items, otherwise completely corresponding to the design, technical, and regulatory requirements, contains items different in reliability by two or more orders of magnitude. That is, there are integrated circuits with hidden defects that can fail both during the run-in period and normal operation, and products that have an increased reliability in comparison with the others. For the elimination of potentially unreliable integrated circuits from the batch, solid rejection tests are carried out, including tests at elevated and lower temperatures, thermal cycling, and electrotermocycling. The method of computer tomography allows one to receive the layered images of integrated circuit under study using measurement of weakening of X-rays on different projections. The method of magnetic resonance allows making scans of an object by radio impulse, created from strong electromagnetic field. These methods are highly relevant for the analysis of integrated circuits because they can provide a very high resolution for the research with obtaining a three-dimension structure, that can be used for detecting microscopic defects, decoding a program algorithm in chip, or getting confirmation on the absence of third-part inclusions or pre-programmed logic in integrated circuit.