期刊
2020 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)
卷 -, 期 -, 页码 -出版社
IEEE
DOI: 10.1109/IEDM13553.2020.9371996
关键词
-
资金
- IBM Physical Sciences Council
The resistance bottleneck in metal-interconnect scaling calls for new interconnect materials. This paper explores topological semimetals as a potential solution. After reviewing the desirable properties of topological semimetals for back-end-of-line (BEOL) interconnects, we use CoSi as an example to demonstrate the decreasing resistance-area product with scaling and provide material-search guidelines.
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