Novel low-dielectric constant and soluble polyimides from diamines containing fluorene and pyridine unit

Polyimides (PI's) with low-dielectric constant and excellent organic solubility have broad application prospects in the electronic field. Herein, this study designed a series of novel, low dielectric, organic soluble PI films by creatively introducing fluorene and pyridine ring into diamine monomers. Because of the noncoplanar structure of fluorenyl and the polarization of pyridine ring, PI films achieved a low-dielectric constant (2.22-3.09 at 10 MHz) and excellent organic solubility. Even in some organic solvents with low-boiling points, these PI films still exhibited outstanding solubility. In addition, all the films possessed high-tensile strength (approximate to 120 MPa) and excellent optical transparency (>70%, 450 nm). It was worth noting that the glass transition temperature of films was all above 280 degrees C and 5% weight loss temperature (T-5%) was at 486-553 degrees C. In general, the novel high-performance low-dielectric PI films are expected to be used in the field of microelectronics.

Automated summary

Novel low-dielectric PI films were designed with the introduction of fluorene and pyridine ring, exhibiting low-dielectric constant, excellent organic solubility, high tensile strength, and excellent optical transparency. These high-performance films are expected to be applied in the field of microelectronics.