期刊
ACS APPLIED POLYMER MATERIALS
卷 3, 期 1, 页码 216-225出版社
AMER CHEMICAL SOC
DOI: 10.1021/acsapm.0c01055
关键词
alumina; epoxy composites; thermal conductivity; coefficient of thermal expansion; synergistic effect
资金
- National Natural Science Foundation of China [51573201]
- NSFC-Zhejiang Joint Fund for the Integration of Industrialization and Informatization [U1709205]
- Public Welfare Project of Zhejiang Province [2016C31026]
- Scientific Instrument Developing Project of the Chinese Academy of Sciences [YZ201640]
- Strategic Priority Research Program of the Chinese Academy of Sciences [XDA22000000]
- Science and Technology Major Project of Ningbo [2016S1002, 2016B10038]
- 3315 Program of Ningbo
The epoxy/AF/Al2O3 composite with a high thermal conductivity of 4.1 W/mK and a significant thermal conductivity enhancement of 2097% demonstrates a promising filler structure for thermal conductivity composites. The synergistic effect between the 3D interconnected AF and Al2O3 microparticles plays a critical role in promoting thermal percolation networks and lowering the coefficient of thermal expansion compared to most epoxy-based composites.
Ceramic/polymer composite with a high thermal conductivity is a candidate of insulating materials for electronic packaging. However, traditional polymer composites filled with alumina (Al2O3) powders present limited enhancement in thermal conductivity even at a high loading due to thermal resistance on the filler/filler and filler/matrix interfaces. Herein, a contiguous 3D network of alumina foam (AF) filled with different diameters of Al2O3 microparticles via vacuum-assisted filtration proves to be a promising filler structure for thermal conductivity composites. The fabricated epoxy/AF/Al2O3 composite exhibits a high thermal conductivity of 4.1 W/mK and a significant thermal conductivity enhancement (TCE) of 2097%. Further study reveals a prominent synergistic effect between the 3D interconnected AF and Al2O3 microparticles, which plays a critical role in the formation of thermal percolation networks to promote thermal conductivity dramatically. Meanwhile, compared to previous reports, the composite resulted in a lower coefficient of thermal expansion (CTE) than those of most epoxy-based composites, showing great potential for heat conduction applications in microelectronics. This result paves an effective way of developing epoxy composites with high thermal conductivity in electronic packaging applications.
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