4.4 Article

Hybrid simulation of radio frequency biased inductively coupled Cl2 plasmas

期刊

PHYSICS OF PLASMAS
卷 28, 期 5, 页码 -

出版社

AIP Publishing
DOI: 10.1063/5.0048522

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资金

  1. National Natural Science Foundation of China (NSFC) [11875101, 11935005, 12020101005]
  2. Natural Science Foundation of Liaoning Province [2020-MS-114]
  3. Fundamental Research Funds for the Central Universities [DUT20LAB201, DUT21LAB110]

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In this study, a hybrid model is used to investigate the evolution of plasma properties in biased ICPs sustained in Cl-2 gases. The results show that the densities of electrons and Cl+ ions increase with bias voltage and ICP power, becoming the dominant species.
In the etching process, a bias source is usually applied to the bottom electrode of an inductively coupled plasma (ICP) source to control the ion energy and angular distribution function (IEADF) independently. In this work, a hybrid model, i.e., a global model combined bi-directionally with a fluid sheath model, is applied to investigate the plasma properties in biased ICPs sustained in Cl-2 gases. The evolutions of the plasma properties with bias voltage are presented for various ICP powers (i.e., 200, 500, and 1000W) at a pressure of 10 mTorr and bias frequency of 13.56MHz. The results indicate that the Cl-2 (v=0) density decreases with ICP power, whereas the densities of electrons and Cl+ ions increase strikingly and they become the dominant charged species at 1000W. In addition, the electron density and Cl+ density increase with bias voltage, and the increasing trend becomes more obvious at higher ICP powers. However, the evolution of the Cl-2(+) density and Cl- density with bias voltage depends on the ICP power. For instance, they first exhibit an increasing trend and then keep constant at 200W, while a slight downward trend is observed at 1000W. In addition, as the bias voltage increases, both the high-energy peak and low-energy peak of IEADFs move toward higher energy, and meanwhile the peak separation becomes wider. The results obtained in this work are of significant importance for improving the etching process.

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