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Quantum entanglement on photonic chips: a review

期刊

ADVANCED PHOTONICS
卷 3, 期 6, 页码 -

出版社

SPIE-SOC PHOTO-OPTICAL INSTRUMENTATION ENGINEERS
DOI: 10.1117/1.AP.3.6.064002

关键词

quantum entanglement; integrated optics; photonic chip

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资金

  1. National Key Research and Development (R&D) Program of China [2019YFA0308702, 2018YFB1107205, 2016YFA0301302]
  2. National Natural Science Foundation of China [61975001, 61590933, 61904196, 61675007, 11975026, 12075159]
  3. Beijing Natural Science Foundation [Z190005]
  4. Key R&D Program of Guangdong Province [2018B030329001]

向作者/读者索取更多资源

Entanglement is a vital property of quantum systems and forms the backbone of quantum information technologies, with photonic integrated circuits playing a key role in generating, manipulating, and measuring entangled photonic states for quantum information processing.
Entanglement is one of the most vital properties of quantum mechanical systems, and it forms the backbone of quantum information technologies. Taking advantage of nano/microfabrication and particularly complementary metal-oxide-semiconductor manufacturing technologies, photonic integrated circuits (PICs) have emerged as a versatile platform for the generation, manipulation, and measurement of entangled photonic states. We summarize the recent progress of quantum entanglement on PICs, starting from the generation of nonentangled and entangled biphoton states, to the generation of entangled states of multiple photons, multiple dimensions, and multiple degrees of freedom, as well as their applications for quantum information processing.

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