3.8 Proceedings Paper

From 0.18μm to 28nm CMOS Down-scaling for Data Links in Body Dust Applications

期刊

2021 IEEE SENSORS
卷 -, 期 -, 页码 -

出版社

IEEE
DOI: 10.1109/SENSORS47087.2021.9639639

关键词

Body Dust; ULP CMOS design; Transistor downscaling; Active Biosensors; sub-10 mu m CMOS Architectures; OOK modulation

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This study explores the impact of transistor downscaling on wireless communication circuits for Body Dust applications, requiring small size and ultra-low power architecture for wireless powering. By scaling the architecture from 0.18 μm to 28 nm CMOS processes, significant improvements in size and power consumption can be achieved.
In this work, we study the effect of transistor downscaling in a wireless communication circuit for Body Dust application. The system requires a chip lateral size smaller than 10 mu m miming the typical size of a red blood cell and so, supporting free circulation in human tissues. Moreover, an ultra-low-power architecture is needed since the system is battery-less and wirelessly powered via acoustic power transfer. The aim of this paper is to present a data communication system for Body Dust systems, which works from the multiplexed sensor read-out front-end to the transmitter back-end taking account diagnostic information on different metabolite concentrations in human body. This work shows that scaling the architecture from a 0.18-mu m to 28-nm CMOS processes, it is possible to improve both size and power consumption. The improvement is about 40 times in size (2000 mu m(2) down to 50 mu m2) and two order of magnitude in average power consumption (10 mu W to cents of nW).

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