期刊
FRONTIERS IN ENERGY
卷 11, 期 1, 页码 78-84出版社
HIGHER EDUCATION PRESS
DOI: 10.1007/s11708-016-0435-5
关键词
n-type Cz-Si; thinner wafer; surface texture; high efficiency; SHJ solar cell
资金
- National High Technology Research and Development Program of China (863 Program) [2011AA050501]
- Main Program of Knowledge Innovation of Chinese Academy of Sciences [KGCX2-YW-399p11]
- International S&T Cooperation Program of China [2015DFA60570]
- Zhangjiang National Innovation Demonstration Zone Special Development Fund [ZJ2015-ZD-001]
- Xi'an Longi Silicon Materials Corp.
n-type CZ-Si wafers featuring longer minority carrier lifetime and higher tolerance of certain metal contamination can offer one of the best Si-based solar cells. In this study, Si heterojuction (SHJ) solar cells which was fabricated with different wafers in the top, middle and tail positions of the ingot, exhibited a stable high efficiency of> 22% in spite of the various profiles of the resistivity and lifetime, which demonstrated the high material utilization of n-type ingot. In addition, for effectively converting the sunlight into electrical power, the pyramid size, pyramid density and roughness of surface of the Cz-Si wafer were investigated by scanning electron microscope (SEM) and transmission electron microscope (TEM). Furthermore, the dependence of SHJ solar cell open-circuit voltage on the surface topography was discussed, which indicated that the uniformity of surface pyramid helps to improve the open-circuit voltage and conversion efficiency. Moreover, the simulation revealed that the highest efficiency of the SHJ solar cell could be achieved by the wafer with a thickness of 100 mu m. Fortunately, over 23% of the conversion efficiency of the SHJ solar cell with a wafer thickness of 100 mu m was obtained based on the systematic optimization of cell fabrication process in the pilot production line. Evidently, the large availability of both n-type ingot and thinner wafer strongly supported the lower cost fabrication of high efficiency SHJ solar cell.
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