A NOVEL QUALITY PREDICTION METHOD BASED ON FEATURE SELECTION CONSIDERING HIGH DIMENSIONAL PRODUCT QUALITY DATA

Product quality is the lifeline of enterprise survival and development. With the rapid development of information technology, the semiconductor manufacturing process produces multitude of quality features. Due to the increasing quality features, the requirement on the training time and classification accuracy of quality prediction methods becomes increasingly higher. Aiming at realizing the quality prediction for semiconductor manufacturing process, this paper proposes a modified support vector machine (SVM) model based on feature selection, considering the high dimensional and nonlinear characteristics of data. The model first improves the Radial Basis Function (RBF) in SVM, and then combines the Duelist algorithm (DA) and variable neighborhood search algorithm (VNS) for feature selection and parameters optimization. Compared with some other SVM models that are based on DA, genetic algorithm (GA), and Information Gain algorithm (IG), the experiment results show that our DA-VNS-SVM can obtain higher classification accuracy rate with a smaller feature subset. In addition, we compare the DA-VNS-SVM with some common machine learning algorithms such as logistic regression, naive Bayes, decision tree, random forest, and artificial neural network. The results indicate that our model outperform these machine learning algorithms for the quality prediction of semiconductor.

Automated summary

This paper proposes a modified support vector machine (SVM) model for quality prediction in semiconductor manufacturing, considering high dimensional and nonlinear data characteristics. Through feature selection and parameter optimization, the model achieves higher classification accuracy with a smaller feature subset compared to other SVM models based on different algorithms, and outperforms common machine learning algorithms in quality prediction for semiconductors.