期刊
ACS APPLIED ELECTRONIC MATERIALS
卷 4, 期 1, 页码 99-103出版社
AMER CHEMICAL SOC
DOI: 10.1021/acsaelm.1c00980
关键词
selector device; hafnium oxide; As ion implantation; high driving current; 3D stacking memory
资金
- National Key Research and Development Program of China [2018YFB0407500, 2017YFA0206101]
- National Natural Science Foundation of China [91964204, 61874129, 61874178]
- Science and Technology Council of Shanghai [20501120300, 18DZ2272800]
- Shanghai Sailing Program [19YF1456100]
- Genetic Engineering of Precious Metal Materials in Yunnan Province (I)-Construction and Application of Precious Metal Materials Professional Database (I) [202002AB080001-1]
The proposed selector based on a nanoscale HfO2 film with As ion implantation has low threshold voltage, high driving current, large selectivity, fast turn on speed, and good endurance, making it applicable for high-density stacked PCM applications.
A large crossbar array is desirable for high-density 3D stacking phase change memory (PCM) applications, in which the leakage current is mainly decided by selector devices. Meanwhile, a large driving current is also needed to meet the Reset operation of the PCM cell. Here, we propose a selector based on a nanoscale HfO2 film via As ion implantation, which has a low threshold voltage of 1.9 V, a milliamp-scale high driving current, a large selectivity of 10(6), fast turn on speed, and good endurance (10(8) switching cycles). These excellent performances make it applicable in the high-density stacked PCM application.
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