期刊
GREEN ENERGY & ENVIRONMENT
卷 7, 期 1, 页码 86-94出版社
KEAI PUBLISHING LTD
DOI: 10.1016/j.gee.2020.07.026
关键词
Graphene; Origami; Bond transformation; Interfacial thermal resistance; Molecular dynamics
类别
资金
- National Natural Science Foundation of China [11972171, 11502217]
- Programs of Innovation and Entrepreneurship of Jiangsu Province
- Fundamental Research Funds for the Central Universities [2452015054, 2452017122]
- China Postdoctoral Science Foundation [2015M570854, 2016T90949]
- Open Fund of Key Laboratory for Intelligent Nano Materials and Devices of the Ministry of Education (NUAA) [INMD-2019M08]
- Thousand Youth Talents Plan
This study systematically investigated the effects of creases on the thermal properties of graphene origami using molecular dynamics simulations. The results showed that tensile strain reduces the interfacial thermal resistance due to the presence of creases. This finding has important implications for the design of next-generation thermal management devices and flexible electronics with tuneable properties.
Graphene is a two-dimensional material that can be folded into diverse and yet interesting nanostructures like macro-scale paper origami. Folding of graphene not only makes different morphological configurations but also modifies their mechanical and thermal properties. Inspired by paper origami, herein we studied systemically the effects of creases, where sp2 to sp3 bond transformation occurs, on the thermal properties of graphene origami using molecular dynamics (MD) simulations. Our MD simulation results show that tensile strain reduces (not increases) the interfacial thermal resistance owing to the presence of the crease. This unusual phenomenon is explained by the micro-heat flux migration and stress distribution. Our findings on the graphene origami enable the design of the next-generation thermal management devices and flexible electronics with tuneable properties. (c) 2020, Institute of Process Engineering, Chinese Academy of Sciences. Publishing services by Elsevier B.V. on behalf of KeAi Communications Co., Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据