期刊
MATERIALS & DESIGN
卷 90, 期 -, 页码 499-507出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2015.10.142
关键词
NiO nanoparticle; Lead-free SAC 305; Intermetallic; Mechanical property; Reflow soldering process
资金
- Ministry of Higher Education, Malaysia
Incorporating various types of ceramic type nanoparticles into Pb-free solder pastes produces unique nanocomposite solder pastes. In this study, Sn-Ag-Cu (SAC) 305 solder alloys were mixed with 0.5, 1.5, and 2.5 wt.% NiO ceramic nano-elements to produce a new set of nanocomposite solder pastes. The displacement phenomenon of NiO nanoparticles during reflow soldering process may contribute efficient idea in the field of microelectronic industries. The reinforcement of reactive nanoparticles in SAC 305 solder paste caused 50% changes in the intermetallic layer thickness and hardness of plain solder. Top-view microstructural analysis wherein dimple surfaces were magnified showed that the combination of SAC 305-2.5 wt.% NiO nanopaste exceeded the limits of alloy addition. (C) 2015 Elsevier Ltd. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据