期刊
MATERIALS & DESIGN
卷 89, 期 -, 页码 703-707出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2015.09.142
关键词
Electromagnetic interference; Flexible transparent electrode; Shielding film; Silver nanowire; Electroless plating
资金
- Ministry of Trade, Industry and Energy (MOTIE)
- Korea Institute for Advancement of Technology (KIAT) through the Promoting Regional Specialized Industry program [R0003322]
- Ministry of Trade, Industry & Energy (MOTIE), Republic of Korea [R0003322] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
The miniaturization of components in modern electronics has made them more susceptible to electromagnetic interference (EMI); therefore, this study proposes a new low-cost method for fabricating highly efficient shielding materials. This approach uses a low cost combination of inverted layer processing of silver nanowires (AgNWs) to produce a conductive network in a polyimide surface, followed by electroless plating of Cu to further enhance conductivity. This results in a highly efficient (>55 dB) EMI shielding film that is less than 10 mu m thick, transparent (>58% transmittance), and sufficiently flexible to maintain its conductivity after bending to a radius of 3 mm for 10,000 times. (C) 2015 Elsevier Ltd. All rights reserved.
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