4.4 Article

Fully Depleted SOI Technology for Millimeter-Wave Integrated Circuits

期刊

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JEDS.2022.3165877

关键词

Transistors; Logic gates; Substrates; MOSFET; Cutoff frequency; Silicon; Integrated circuits; RF CMOS; silicon-on-insulator (SOI) technology; fully depleted (FD) SOI transistor; RF and millimeter-wave performance; high temperature; cryogenic temperature; RF switches; LNA; siliconbased substrate; high resistivity Si substrate

资金

  1. Ecsel JU Project Beyond5 through EU H2020
  2. Innoviris, Brussels, Belgium [876124]

向作者/读者索取更多资源

This article discusses the correlation between the performance of high-frequency integrated circuits and the analog and high-frequency characteristics of transistors, the quality of the back-end line process, and the electromagnetic properties of the substrate. It also explores the potential applications of partially depleted and fully depleted SOI MOSFETs in wireless communication systems, as well as summarizes recent research on FD SOI switches and low-noise amplifiers. The article also discusses the potential interest and challenges of transitioning from standard resistivity FD SOI substrates to high resistivity ones.
Performances of high-frequency integrated circuits are directly linked to the analog and high frequency characteristics of the transistors, the quality of the back-end of line process as well as the electromagnetic properties of the substrate. Today, Partially Depleted Silicon-on-Insulator (SOI) MOSFET is the mainstream technology for RF SOI systems. Fully Depleted (FD) SOI MOSFET is foreseen as one of the most promising candidates for the development of future lower power wireless communication systems operating in the millimeter-wave range. The high frequency performances of FD SOI transistors are presented at room but also at cryogenic and high temperature. Recently published results for FD SOI switches and low noise amplifiers are summarized. And finally, the potential interest and challenges to move from standard to high resistivity FD SOI substrates are discussed.

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