4.7 Article

Chip-to-chip quantum photonic interconnect by path-polarization interconversion

期刊

OPTICA
卷 3, 期 4, 页码 407-413

出版社

OPTICAL SOC AMER
DOI: 10.1364/OPTICA.3.000407

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资金

  1. Engineering and Physical Sciences Research Council (EPSRC)
  2. European Research Council (ERC)
  3. Photonic Integrated Compound Quantum Encoding (PICQUE)
  4. FP7 Action: Beyond the Barriers of Optical Integration (BBOI)
  5. PHORBITECH
  6. QUANTIP
  7. US Army Research Office (ARO) [W911NF-14-1-0133]
  8. Air Force Office of Scientific Research (AFOSR)
  9. ImPACT Program of the Cabinet Office Japan
  10. Centre for Nanoscience and Quantum Information (NSQI)
  11. Natural Sciences and Engineering Research Council of Canada (NSERC)
  12. Alexander Graham Bell Canada Graduate Scholarship
  13. Royal Society Wolfson Merit Award
  14. Royal Academy of Engineering
  15. Engineering and Physical Sciences Research Council [EP/K033085/1, EP/M013472/1, EP/M01326X/1, EP/L024020/1] Funding Source: researchfish
  16. EPSRC [EP/L024020/1, EP/K033085/1, EP/M013472/1, EP/M01326X/1] Funding Source: UKRI

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Integrated photonics has enabled much progress toward quantum technologies. Many applications, e.g., quantum communication, sensing, and distributed cloud quantum computing, require coherent photonic interconnection between separate on-chip subsystems. Large-scale quantum computing architectures and systems may ultimately require quantum interconnects to enable scaling beyond the limits of a single wafer, and toward multi-chip systems. However, coherently connecting separate chips remains a challenge, due to the fragility of entangled quantum states. The distribution and manipulation of entanglement between multiple integrated devices is one of the strictest requirements of these systems. Here, we report, to the best of our knowledge, the first quantum photonic interconnect, demonstrating high-fidelity entanglement distribution and manipulation between two separate photonic chips, implemented using state-of-the-art silicon photonics. Path-entangled states are generated on one chip, and distributed to another chip by interconverting between path and polarization degrees of freedom, via a two-dimensional grating coupler on each chip. This path-to-polarization conversion allows entangled quantum states to be coherently distributed. We use integrated state analyzers to confirm a Bell-type violation of S = 2.638 +/- 0.039 between the two chips. With further improvements in loss, this quantum photonic interconnect will provide new levels of flexibility in quantum systems and architectures. (C) 2016 Optical Society of America

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