4.7 Article

Strength and ductility synergy in a laminated Cu/Cu-6Al alloy with graded interfacial region

期刊

JOURNAL OF ALLOYS AND COMPOUNDS
卷 921, 期 -, 页码 -

出版社

ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcum.2022.166102

关键词

Stacking fault energy; Cu-Al alloy; Laminated materials; Graded interfacial region

资金

  1. Natural Science Foundation of Hunan Province, China [2022JJ40588]
  2. Changsha Municipal Natural Science Foundation, China [kp2014125]
  3. Hunan Provincial Innovation Foundation for Postgraduate, China [CX20210123]
  4. Graduate Independent Exploration and Innovation Project of Central South University, China [2021zzts0581]

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The trade-off between strength and ductility has been studied for a long time. Designing heterogeneous structures is considered a promising strategy to improve mechanical properties. Researchers fabricated a laminated Cu/Cu-6Al alloy with a graded interfacial region, which effectively relieves stress concentration and provides continuous working hardening ability. The alloy exhibits a combination of high strength and large ductility.
The trade-off between strength and ductility of structural materials has been the subject of research for a long time. Designing heterogeneous structures is considered to be a promising and suitable strategy to improve the mechanical properties, including both the strength and ductility. In this work, we fabricated a laminated Cu/Cu-6Al alloy by powder metallurgy technique. The laminated Cu/Cu-6Al alloy possesses a graded interfacial region with the width of similar to 50 mu m due to the diffusion of elements during sintering and hot rolling. The graded interfacial structure can effectively relieve the stress concentration at the interface by coordinating multiple deformation mechanisms from dislocation activity to deformation twinning, and thus provide continues working hardening ability. The laminated Cu/Cu-6Al alloy possesses a combination of high strength and large ductility. This work provides a new concept to design high-performance structural materials by forming graded interfaces. (C) 2022 Elsevier B.V. All rights reserved.

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