期刊
CHEMICAL COMMUNICATIONS
卷 58, 期 74, 页码 10337-10340出版社
ROYAL SOC CHEMISTRY
DOI: 10.1039/d2cc03848j
关键词
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资金
- National Science Foundation [DMR-1555356, ECCS: 1542182]
- Nebraska Research Initiative
This paper describes a general approach to enhance the adhesion of metal films to commonly used plastic substrates using a metal-chelating polymer, polyethyleneimine, in combination with patterned electroless deposition. This general fabrication method is compatible with a wide range of plastics and metals, making it suitable for flexible electronic circuits and electrochemical cells.
A general approach to increase the adhesion of metal films to commodity plastic substrates using a metal-chelating polymer, polyethyleneimine, in conjunction with patterned electroless deposition is described. This general fabrication method is compatible with a diverse array of plastics and metals with properties applicable to flexible electronic circuits and electrochemical cells.
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