Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films

A general approach to increase the adhesion of metal films to commodity plastic substrates using a metal-chelating polymer, polyethyleneimine, in conjunction with patterned electroless deposition is described. This general fabrication method is compatible with a diverse array of plastics and metals with properties applicable to flexible electronic circuits and electrochemical cells.

Automated summary

This paper describes a general approach to enhance the adhesion of metal films to commonly used plastic substrates using a metal-chelating polymer, polyethyleneimine, in combination with patterned electroless deposition. This general fabrication method is compatible with a wide range of plastics and metals, making it suitable for flexible electronic circuits and electrochemical cells.