期刊
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
卷 69, 期 -, 页码 49-55出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2014.10.027
关键词
Polymer-matrix composites (PMCs); Glass fibers; Mechanical properties; Thermal properties
资金
- Guangdong and Shenzhen Innovative Research Team Program [2011D052, KYPT20121228160843692]
- Shenzhen Electronic Packaging Materials Engineering Laboratory [2012-372]
Rapidly increasing packaging density of electronic devices puts forward higher requirements for thermal conductivity of glass fibers reinforced polymer (GFRP) composites, which are commonly used as substrates in printed circuit board. Interface between fillers and polymer matrix has long been playing an important role in affecting thermal conductivity. In this paper, the effect of interfacial state on the thermal conductivity of functionalized Al2O3 filled GFRP composites was evaluated. The results indicated that amino groups-Al2O3 was demonstrated to be effective filler to fabricate thermally conductive GFPR composite (1.07 W/m K), compared with epoxy group and graphene oxide functionalized Al2O3. It was determined that the strong adhesion at the interface and homogeneous dispersion of filler particles were the key factors. Moreover, the effect of interfacial state on dielectric and thermomechanical properties of GFRP composites was also discussed. This research provides an efficient way to develop high-performance GFRP composites with high thermal conductivity for integrated circuit packaging applications. (C) 2014 Elsevier Ltd. All rights reserved.
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