4.4 Article

Hybrid Soldering 2.3D Assembly With High Reliability and Low Cost

期刊

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JEDS.2022.3205951

关键词

Soldering; Substrates; Reliability; Packaging; Stress; Costs; Printing; 2; 3D integration; RDL interposer; hybrid soldering; hybrid joint

资金

  1. Ministry of Education (MOE), Taiwan
  2. National Science and Technology Council, Taiwan [NSTC 111-2634-F-A49-008-, NSTC 109-2221-E-009-023-MY3, NSTC 110-2221-E-A49-086-MY3]

向作者/读者索取更多资源

In this study, an advanced 2.3D solution is proposed to integrate RDL interposer and FR-4 substrate using hybrid soldering technique. The simulation and experimental results validate that this solution has great potential for high reliability 2.3D assembly without the need for underfill.
In this study, an advanced 2.3D solution was proposed to integrate RDL interposer and FR-4 substrate using the technique of hybrid soldering, which applies printing of epoxy solder paste to form the hybrid joint. The simulation was performed to evaluate warpage and von Mises stress of different joint structures, indicating that the hybrid joint structure is promising for the reliability of 2.3D assembly. In addition, hybrid soldering 2.3D assembly was successfully demonstrated, followed by SEM analyses, electrical measurements, warpage measurements, and thermal cycling tests for 5000 cycles. The experimental results validate that the packaging can achieve high reliability without the needs of underfill. Thus, this solution paves the way for large area 2.3D integration with low cost, high throughput, and high reliability.

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