期刊
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
卷 10, 期 -, 页码 791-796出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JEDS.2022.3205951
关键词
Soldering; Substrates; Reliability; Packaging; Stress; Costs; Printing; 2; 3D integration; RDL interposer; hybrid soldering; hybrid joint
资金
- Ministry of Education (MOE), Taiwan
- National Science and Technology Council, Taiwan [NSTC 111-2634-F-A49-008-, NSTC 109-2221-E-009-023-MY3, NSTC 110-2221-E-A49-086-MY3]
In this study, an advanced 2.3D solution is proposed to integrate RDL interposer and FR-4 substrate using hybrid soldering technique. The simulation and experimental results validate that this solution has great potential for high reliability 2.3D assembly without the need for underfill.
In this study, an advanced 2.3D solution was proposed to integrate RDL interposer and FR-4 substrate using the technique of hybrid soldering, which applies printing of epoxy solder paste to form the hybrid joint. The simulation was performed to evaluate warpage and von Mises stress of different joint structures, indicating that the hybrid joint structure is promising for the reliability of 2.3D assembly. In addition, hybrid soldering 2.3D assembly was successfully demonstrated, followed by SEM analyses, electrical measurements, warpage measurements, and thermal cycling tests for 5000 cycles. The experimental results validate that the packaging can achieve high reliability without the needs of underfill. Thus, this solution paves the way for large area 2.3D integration with low cost, high throughput, and high reliability.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据