期刊
COMPOSITE STRUCTURES
卷 124, 期 -, 页码 19-28出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.compstruct.2014.12.069
关键词
FM-94 epoxy; Temperature dependent; Viscoelastic; TMA; DMA
Epoxy FM-94 has a temperature dependent and viscoelastic response which is used for metal bonding applications and composite laminates like GLARE. A Dynamic Mechanical Analysis is performed on the epoxy FM-94 adhesive. A master curve is produced using the time-temperature superposition principle and is modelled as a Prony series. In addition, the cure kinetics of the adhesive are measured using DSC (Differential Scanning Calorimetry) and fitted to a standard kinetic model. Both the kinetics and the thermo-viscoelastic models can be used in subsequent research to predict the cure induced and residual thermal stresses due to the composite processing steps. (C) 2015 Elsevier Ltd. All rights reserved.
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