Flexible selection of the functional-group ratio on a polytetrafluoroethylene (PTFE) surface using a single-gas plasma treatment

During plasma treatment of polymers, etching occurs and functional groups are introduced on their surface. We assumed that controlling the etching rate would enable plasma treatment using a single gas to control the ratio of functional groups generated on a polymer's surface, although previous studies have indicated that several different types of functional groups are formed when the gaseous species are varied. In this study, we selected the base pressure (BP) as a parameter for controlling the etching rate and subjected polytetrafluoroethylene (PTFE) to plasma treatments using only He gas at various BPs. The chemical composition of the surface of the plasma-treated PTFE samples was evaluated by X-ray photoelectron spectroscopy (XPS), and the ratios of fluorine (CF3, CF2, C-F), oxygen (O-C=O, C=O, C-O), and carbon (C-C, C=C) groups were quantified from the C 1s-XPS spectra. The fluorine-group ratio decreased and the oxygen- and carbon-group ratios increased with decreasing BP. The results demonstrated that plasma treatment using a single gas enabled flexible selection of the ratio of functional groups generated on PTFE via control of the BP.

Automated summary

During plasma treatment of polymers, the etching rate can be controlled by varying the base pressure. In this study, polytetrafluoroethylene (PTFE) was subjected to plasma treatments using only He gas at various base pressures. The results showed that controlling the base pressure enables flexible selection of the ratio of functional groups generated on PTFE.